Title :
Computational analysis and performance evaluation of representative wafer scale integration interconnections
Author :
Lyke, James C., Jr. ; Kolesar, Edward S., Jr.
Author_Institution :
Air Force Inst. of Technol., Wright-Patterson AFB, Dayton, OH, USA
Abstract :
The electrical performance of wafer-scale integration interconnections was studied, with an emphasis on the characteristic impedance. The study was based on closed-form expressions, finite difference method models, commercially available microwave circuit analysis software, and a numerical evaluation of the Telegrapher equations. Measurements were conducted on 5-in-diameter test wafers which contained numerous interconnection structures. The results revealed interesting information concerning the driving-point impedances of the structures, the inadequacy of closed-form models for accurate estimation, and the need for more accurate modeling techniques.<>
Keywords :
VLSI; automatic testing; circuit analysis computing; electric impedance measurement; finite difference methods; integrated circuit testing; microstrip lines; multichip modules; transmission line theory; 5 inch; Telegrapher equations; characteristic impedance; closed-form expressions; computational analysis; driving-point impedances; electrical performance; finite difference method models; microstrip; microwave circuit analysis software; modeling; numerical evaluation; performance evaluation; stripline; wafer scale integration interconnections; Circuit analysis; Closed-form solution; Difference equations; Finite difference methods; Impedance; Integrated circuit interconnections; Microwave theory and techniques; Performance analysis; Semiconductor device modeling; Wafer scale integration;
Conference_Titel :
AUTOTESTCON '92. IEEE Systems Readiness Technology Conference, Conference Record
Conference_Location :
Dayton, OH, USA
Print_ISBN :
0-7803-0643-0
DOI :
10.1109/AUTEST.1992.270106
