DocumentCode :
1605473
Title :
A compact BT/WiFi dual-band dual-mode RF front-end module
Author :
Kim, Dongsu ; Kim, Dong Ho ; Ryu, Jong In ; Kim, Jun Chul ; Park, Youngcheol ; Park, Jong Chul
Author_Institution :
Packaging Res. Center, Korea Electron. Technol. Inst., Seongnam, South Korea
fYear :
2011
Firstpage :
110
Lastpage :
113
Abstract :
A compact BT/WiFi dual-band dual-mode RF front-end module (FEM) with LTCC-based embedded passives is presented in this paper. The proposed RF FEM is composed of a diplexer, three baluns, and a matching network, which are realized in the LTCC substrate. Furthermore, an SPDT, an SP3T, a dual-band power amplifier, and low noise amplifiers are placed on top of the substrate. The compact and low-profile embedded diplexer and baluns are designed and implemented with LC lumped-element approach, resulting in a quite low insertion loss and a good amplitude/phase balance. These passive components and DC bias lines are stacked up with four inner ground planes for minimizing unexpected coupling effect as well as space saving. The size of the proposed RF FEM is only 4.5 mm × 4.5 mm with a total thickness of 1.2 mm. The implemented RF FEM provides a P1dB of more than 20 dBm and sufficient adjacent channel power characteristics at both frequency bands. In BT path, we obtain an average insertion loss of about 3.4 dB with good amplitude and phase balance. Also, the FEM has an overall gain of about 6.7 dB at 2.45 GHz and about 8 dB at 5.5 GHz for WiFi Rx operations.
Keywords :
ceramic packaging; low noise amplifiers; microwave power amplifiers; multiplexing equipment; DC bias lines; LC lumped-element approach; LTCC substrate; SP3T; SPDT; compact BT-WiFi dual-band dual-mode RF FEM; compact BT-WiFi dual-band dual-mode RF front-end module; compact embedded diplexer; dual-band power amplifier; frequency 5.5 GHz; frequency 6.75 GHz; ground planes; low noise amplifiers; low-profile embedded diplexer; matching network; size 1.2 mm; Finite element methods; Gain; IEEE 802.11 Standards; Impedance matching; Insertion loss; Radio frequency; Substrates; LTCC; RF FEM; embedded passives;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4577-2034-5
Type :
conf
Filename :
6173698
Link To Document :
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