DocumentCode :
1605553
Title :
Adsorption-controlled growth of BiFeO3 by MBE and integration with wide band gap semiconductors
Author :
Ihlefeld, J.F. ; Tian, W. ; Liu, Z.K. ; Doolittle, W.A. ; Bernhagen, M. ; Reiche, P. ; Uecker, R. ; Ramesh, R. ; Schlom, D.G.
Author_Institution :
Materials Research Institute, The Pennsylvania State University, University Park, 16802, USA
Volume :
2
fYear :
2008
Firstpage :
1
Lastpage :
2
Abstract :
BiFeO3 thin films have been deposited on (101) DyScO3, (0001) AlGaN/GaN, and (0001) SiC single crystal substrates by reactive molecular-beam epitaxy in an adsorption-controlled growth regime. This is achieved by supplying a bismuth over-pressure and utilizing the differential vapor pressures between bismuth oxides and BiFeO3 to control stoichiometry. Four-circle x-ray diffraction reveals phase-pure, epitaxial films with rocking curve full width at half maximum values as narrow as 7.2 arc seconds (0.002??). Epitaxial growth of (0001)-oriented BiFeO3 thin films on (0001) GaN, including AlGaN HEMT structures, and (0001) SiC has been realized utilizing intervening epitaxial (111) SrTiO3 / (100) TiO2 buffer layers. The epitaxial BiFeO3 thin films have two in-plane orientations: [112??0] BiFeO3 ?? [112??0] GaN (SiC) plus a twin variant related by a 180?? in-plane rotation. This epitaxial integration of the ferroelectric with the highest known polarization, BiFeO3, with wide band gap semiconductors is an important step toward novel field-effect devices.
Keywords :
Aluminum gallium nitride; Bismuth; Gallium nitride; Molecular beam epitaxial growth; Pressure control; Semiconductor thin films; Silicon carbide; Sputtering; Substrates; Wide band gap semiconductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 2008. ISAF 2008. 17th IEEE International Symposium on the
Conference_Location :
Santa Re, NM, USA
ISSN :
1099-4734
Print_ISBN :
978-1-4244-2744-4
Electronic_ISBN :
1099-4734
Type :
conf
DOI :
10.1109/ISAF.2008.4693774
Filename :
4693774
Link To Document :
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