DocumentCode
1606194
Title
Effects of R-ratio and wave form on the fatigue of 63Sn-37Pb solder used in electronic packaging
Author
Bae, K. ; Guo, Z. ; Sprecher, A.F. ; Conrad, H. ; Jung, D.Y.
Author_Institution
North Carolina State Univ., Raleigh, NC, USA
fYear
1988
Firstpage
143
Lastpage
148
Abstract
The present investigation is a continuation of the authors´ studies into the fatigue of Pb-Sn solder joints related to electronic packaging. Total-strain-controlled, low-cycle fatigue tests in shear at 300 K were conducted on 63Sn-37Pb solder joints with ramp straining (R=0 and R=-1) and square-wave straining (R=-1). All results followed the Coffin-Manson equation. Both R and waveform had an effect on changes in the hysteresis loops as a function of the number of cycles.<>
Keywords
fatigue testing; lead alloys; packaging; reliability; soldering; tin alloys; 300 K; Coffin-Manson equation; PbSn solder joints; R-ratio effects; electronic packaging; fatigue testing; hysteresis loops; low-cycle fatigue tests; number of cycles; ramp straining; square-wave straining; waveform effects; Capacitive sensors; Electronics packaging; Equations; Fatigue; Frequency; Hysteresis; Plastics; Soldering; Strain control; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location
Lake Buena Vista, FL, USA
Type
conf
DOI
10.1109/EMTS.1988.16166
Filename
16166
Link To Document