Title :
Printed circuit board inspection using image analysis
Author :
Loh, Homg-Hai ; Lu, Ming-Sing
Author_Institution :
Dept. of Electr. Eng., Nat. Yunlin Inst. of Technol., Taiwan
Abstract :
This paper presents an inspection system for the defects on surface mounted device (SMD) printed circuit boards (PCBs). There are five types of defects, namely, missing component, misalignment, wrong orientation of IC chip, wrong parts and poor solder joints. Thus, different algorithms are developed to detect these faults. Vision system has been introduced into almost every level of PCB manufacturing. They include PCB pattern inspection machines, SMD mounter with visual positioning, mounted SMD visual inspection machines, soldering inspection machines, assembled PCB visual inspection machines etc. Most of these vision systems are integrated successfully and achieve significant benefits. But the rapid development of surface mounted technology makes precision SMD mounters and visual inspection machines become necessary. Efforts are being made to develop precision SMD mounters and solder inspection systems
Keywords :
automatic optical inspection; printed circuit testing; surface mount technology; IC chip orientation; PCB manufacturing; SMD; image analysis; misalignment; missing component; pattern inspection; poor solder joints; printed circuit board inspection; soldering inspection; surface mounted device; visual inspection; visual positioning; wrong orientation; wrong parts; Assembly; Circuit faults; Electrical fault detection; Fault detection; Image analysis; Inspection; Machine vision; Manufacturing; Printed circuits; Soldering;
Conference_Titel :
Industrial Automation and Control: Emerging Technologies, 1995., International IEEE/IAS Conference on
Conference_Location :
Taipei
Print_ISBN :
0-7803-2645-8
DOI :
10.1109/IACET.1995.527640
