• DocumentCode
    1606856
  • Title

    Improved Retention for a Al2O3 IPD Embedded Flash Cell without Top-Oxide

  • Author

    Power, J.R. ; Shum, D. ; Gong, Yu ; Bogacz, S. ; Haeupel, J. ; Estel, H. ; Strenz, Robert ; Kakoschke, R. ; van der Zanden, K. ; Allinger, R.

  • Author_Institution
    Infineon Technol. Dresden, GmbH & Co. OHG, Dresden
  • fYear
    2008
  • Firstpage
    93
  • Lastpage
    96
  • Abstract
    Using a 2Mb embedded Flash cell array as a demonstrator, we reported previously that a 3 V reduction in programming voltage was possible by replacing the ONO inter- poly dielectric (IPD) with an IPD comprising the high-k material, AI2O3 by Kakoschke, R., et al, (2007). Adding a thin protective top-oxide to the high-k IPD was later shown to significantly improve reliability in Power, J. R., et al, (2007). In this paper, we show that for integration schemes more suited to the material properties of AI2O3, reliably functioning 2 Mb demonstrators with a high-k IPD but without top-oxide protection are also feasible.
  • Keywords
    aluminium compounds; dielectric materials; flash memories; permittivity; IPD embedded flash cell; ONO inter-poly dielectric; embedded Flash cell array; programming voltage; reliably functioning; top-oxide protection; Aluminum oxide; Annealing; Character generation; High K dielectric materials; High-K gate dielectrics; Logic arrays; Material properties; Protection; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Non-Volatile Semiconductor Memory Workshop, 2008 and 2008 International Conference on Memory Technology and Design. NVSMW/ICMTD 2008. Joint
  • Conference_Location
    Opio
  • Print_ISBN
    978-1-4244-1546-5
  • Electronic_ISBN
    978-1-4244-1547-2
  • Type

    conf

  • DOI
    10.1109/NVSMW.2008.33
  • Filename
    4531833