DocumentCode
1606856
Title
Improved Retention for a Al2O3 IPD Embedded Flash Cell without Top-Oxide
Author
Power, J.R. ; Shum, D. ; Gong, Yu ; Bogacz, S. ; Haeupel, J. ; Estel, H. ; Strenz, Robert ; Kakoschke, R. ; van der Zanden, K. ; Allinger, R.
Author_Institution
Infineon Technol. Dresden, GmbH & Co. OHG, Dresden
fYear
2008
Firstpage
93
Lastpage
96
Abstract
Using a 2Mb embedded Flash cell array as a demonstrator, we reported previously that a 3 V reduction in programming voltage was possible by replacing the ONO inter- poly dielectric (IPD) with an IPD comprising the high-k material, AI2O3 by Kakoschke, R., et al, (2007). Adding a thin protective top-oxide to the high-k IPD was later shown to significantly improve reliability in Power, J. R., et al, (2007). In this paper, we show that for integration schemes more suited to the material properties of AI2O3, reliably functioning 2 Mb demonstrators with a high-k IPD but without top-oxide protection are also feasible.
Keywords
aluminium compounds; dielectric materials; flash memories; permittivity; IPD embedded flash cell; ONO inter-poly dielectric; embedded Flash cell array; programming voltage; reliably functioning; top-oxide protection; Aluminum oxide; Annealing; Character generation; High K dielectric materials; High-K gate dielectrics; Logic arrays; Material properties; Protection; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Non-Volatile Semiconductor Memory Workshop, 2008 and 2008 International Conference on Memory Technology and Design. NVSMW/ICMTD 2008. Joint
Conference_Location
Opio
Print_ISBN
978-1-4244-1546-5
Electronic_ISBN
978-1-4244-1547-2
Type
conf
DOI
10.1109/NVSMW.2008.33
Filename
4531833
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