Title :
Design of UWB RF receiver front-end with heterogeneous chip integration
Author :
Lin, Y.-C. ; Ye, R.-F. ; Lee, C.-T. ; Horng, T.-S. ; Hwang, L.-T. ; Wu, J.-M.
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
In this work, a 3-5 GHz CMOS UWB RF receiver front-end design is described. The design was realized using integrated passive device (IPD) package format as system-in-package (SiP) application. The CMOS circuit consists of a fully differential common gate-low noise amplifier (CG-LNA), an IQ downconversion mixer, and a variable gain amplifier. Three low loss IPD transformer baluns are used to convert unbalanced signals into balanced signals for feeding into the RF and LO input ports of the CMOS circuit. Measurement results indicate that the average conversion gain is 16.3 dB while the average IIP3 and noise figure are around -10.4 dBm and 6.1 dB, respectively, over the entire operating frequency range.
Keywords :
CMOS integrated circuits; MMIC; baluns; integrated circuit design; integrated circuit noise; radio receivers; system-in-package; transformers; ultra wideband communication; CMOS UWB RF receiver front-end design; IPD package format; IQ downconversion mixer; LO input port; RF input port; SiP application; average IIP3; average conversion gain; frequency 3 GHz to 5 GHz; fully differential CG-LNA; fully differential common gate-low noise amplifier; gain 16.3 dB; heterogeneous chip integration; integrated passive device package format; low loss IPD transformer balun; noise figure; operating frequency range; system-in-package application; unbalanced signals conversion; variable gain amplifier; CMOS integrated circuits; Gain; Impedance matching; Noise; Noise measurement; Radio frequency; Receivers; CMOS RFIC; RF front-end; UWB receiver; integrated passive device; system-in-package;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4577-2034-5
