DocumentCode :
1606987
Title :
Performance Enhancement in Ultra-Scaled SONOS FinFlash by Inclusion of High-k Dielectric in the Gate Stack
Author :
Jahan, C. ; Nowak, E. ; Perniola, L. ; Gely, M. ; Molas, G. ; Lombardo, S. ; Salvo, B. De ; Deleonibus, S.
Author_Institution :
CEA/LETI-Minatec, Grenoble
fYear :
2008
Firstpage :
106
Lastpage :
108
Abstract :
This paper presents the technological process and electrical behaviour of SONOS FinFlash devices fabricated on silicon-on-insulator (SOI) substrates and including HfO2 in the inter poly dielectric (IPD). Using trimming techniques, ultra-scaled devices were processed with aggressive dimensions down to 10 nm channel width and 30 nm gate length. Good performances are obtained in Fowler-Nordheim (FN) operation on these structures.
Keywords :
dielectric materials; flash memories; hafnium compounds; high-k dielectric thin films; silicon-on-insulator; Fowler-Nordheim operation; HfO2; SONOS FinFlash; gate stack; high-k dielectric; inter poly dielectric; silicon-on-insulator; size 30 nm; Dielectric devices; Dielectric substrates; Fabrication; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Implants; Leakage current; SONOS devices; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Non-Volatile Semiconductor Memory Workshop, 2008 and 2008 International Conference on Memory Technology and Design. NVSMW/ICMTD 2008. Joint
Conference_Location :
Opio
Print_ISBN :
978-1-4244-1546-5
Electronic_ISBN :
978-1-4244-1547-2
Type :
conf
DOI :
10.1109/NVSMW.2008.37
Filename :
4531837
Link To Document :
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