DocumentCode
1607534
Title
Material characterization with the ultrasonic microscope
Author
Gust, Norbert ; Kuhnicke, Elfgard ; Breuer, Dirk
Author_Institution
Electron. Packaging Lab., Tech. Univ. of Dresden, Dresden, Germany
fYear
2008
Firstpage
91
Lastpage
95
Abstract
An effective method for material characterization with a scanning acoustic microscope (SAM) is presented. The elastic parameters Young´s modulus and bulk modulus and the density are determined from one single reflection signal. In contrast to established methods a calibration specimen is not required. Additionally, the thickness of the specimen can be estimated with two reflection signals at different focus positions. The new method evaluates the parameters of the surface echo, the longitudinal backwall echo and the mode converted transverse wave backwall echo. With estimated material characteristics, a simulation is set up and results are compared to the measured reflection parameters. Accordingly, the material characteristics are iteratively adapted until a minimum error criterion is reached. This approach can deliver results as accurate as the ultrasonic simulation. The results of a new and fast ray-trace based simulation will be verified with reference measurements and finite element simulations combined with a sound-field measurement.
Keywords
Young´s modulus; acoustic microscopes; echo; finite element analysis; ultrasonic materials testing; Young´s modulus; bulk modulus; density; elastic parameters; fast ray-trace based simulation; finite element simulations; focus positions; longitudinal backwall echo; material characterization; minimum error criterion; mode converted transverse wave backwall echo; reference measurements; scanning acoustic microscope; single reflection signal; sound-field measurement; specimen thickness; surface echo; ultrasonic microscope; Acoustic materials; Acoustic reflection; Calibration; Conducting materials; Electronic equipment testing; Electronics packaging; Microscopy; Nondestructive testing; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location
Budapest
Print_ISBN
978-1-4244-3972-0
Electronic_ISBN
978-1-4244-3974-4
Type
conf
DOI
10.1109/ISSE.2008.5276445
Filename
5276445
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