Title :
Material characterization with the ultrasonic microscope
Author :
Gust, Norbert ; Kuhnicke, Elfgard ; Breuer, Dirk
Author_Institution :
Electron. Packaging Lab., Tech. Univ. of Dresden, Dresden, Germany
Abstract :
An effective method for material characterization with a scanning acoustic microscope (SAM) is presented. The elastic parameters Young´s modulus and bulk modulus and the density are determined from one single reflection signal. In contrast to established methods a calibration specimen is not required. Additionally, the thickness of the specimen can be estimated with two reflection signals at different focus positions. The new method evaluates the parameters of the surface echo, the longitudinal backwall echo and the mode converted transverse wave backwall echo. With estimated material characteristics, a simulation is set up and results are compared to the measured reflection parameters. Accordingly, the material characteristics are iteratively adapted until a minimum error criterion is reached. This approach can deliver results as accurate as the ultrasonic simulation. The results of a new and fast ray-trace based simulation will be verified with reference measurements and finite element simulations combined with a sound-field measurement.
Keywords :
Young´s modulus; acoustic microscopes; echo; finite element analysis; ultrasonic materials testing; Young´s modulus; bulk modulus; density; elastic parameters; fast ray-trace based simulation; finite element simulations; focus positions; longitudinal backwall echo; material characterization; minimum error criterion; mode converted transverse wave backwall echo; reference measurements; scanning acoustic microscope; single reflection signal; sound-field measurement; specimen thickness; surface echo; ultrasonic microscope; Acoustic materials; Acoustic reflection; Calibration; Conducting materials; Electronic equipment testing; Electronics packaging; Microscopy; Nondestructive testing; Ultrasonic transducers; Ultrasonic variables measurement;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276445