Title :
Challenges and opportunities in the broadband connected world
Author_Institution :
Broadcom Corp., Irvine, CA, USA
Abstract :
The communications IC industry is experiencing explosive growth as a result of the emergence of highly integrated, very low cost, mixed-mode (digital, analog and RF) system-on-a-chip (SoC) solutions that enable virtually every electronic device to be connected to a network. There are a multitude of communications technologies that are being developed to address the diverse demands of the connected user. The desirability of user mobility has driven wireless communications to be one of the fastest growing sectors of the communications IC industry. The requirement for very low power dissipation in these battery powered devices presents some unique challenges to the process technology industry as leakage currents and the inability to reduce power supply voltages much further become the limiting factors in choosing whether or not to adopt a next generation process node for a particular design.
Keywords :
VLSI; system-on-chip; telecommunication equipment; broadband connected world; communications IC industry; electronic device; leakage currents; limiting factors; mixed-mode; network; next generation process node; system-on-a-chip; very low power dissipation; Analog integrated circuits; Communication industry; Digital integrated circuits; Electricity supply industry; Explosives; Radio frequency; Radiofrequency integrated circuits; System-on-a-chip;
Conference_Titel :
VLSI Technology, 2004. Digest of Technical Papers. 2004 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-8289-7
DOI :
10.1109/VLSIT.2004.1345358
