Thick film resistor testing by electro — Ultrasonic spectroscopy with DC electric signal

Author

Pavel, Tofel ; Vlasta, Sedlakova ; Josef, Sikula

Author_Institution

Dept. of Phys., Univ. of Technol., Brno, Czech Republic

fYear

2008

Firstpage

73

Lastpage

76

Abstract

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 Omega to 1 Omega, which corresponds to the relative resistance change of the order from 10^-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator.

Keywords

phonons; thick film resistors; ultrasonic materials testing; DC electric signal; charge carrier; electro-ultrasonic spectroscopy; nondestructive testing; ntermodulation signal; phonon; polymer based thick film structure; resistance modulation; thick film resistor; ultrasonic vibration; Charge carriers; Contact resistance; Electric resistance; Nondestructive testing; Phonons; Polymer films; Resistors; Spectroscopy; Thick films; Ultrasonic imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276457

Filename

5276457