Title :
Thick film resistor testing by electro — Ultrasonic spectroscopy with DC electric signal
Author :
Pavel, Tofel ; Vlasta, Sedlakova ; Josef, Sikula
Author_Institution :
Dept. of Phys., Univ. of Technol., Brno, Czech Republic
Abstract :
The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 Omega to 1 Omega, which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator.
Keywords :
phonons; thick film resistors; ultrasonic materials testing; DC electric signal; charge carrier; electro-ultrasonic spectroscopy; nondestructive testing; ntermodulation signal; phonon; polymer based thick film structure; resistance modulation; thick film resistor; ultrasonic vibration; Charge carriers; Contact resistance; Electric resistance; Nondestructive testing; Phonons; Polymer films; Resistors; Spectroscopy; Thick films; Ultrasonic imaging;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276457
