• DocumentCode
    1607887
  • Title

    Manufacturing of the first toroidal field coil for the JT-60SA magnet system

  • Author

    Cucchiaro, A. ; Polli, Gian Mario ; Cocilovo, Valter ; Drago, Giovanni ; Cuneo, Stefano ; Terzi, Franco ; Phillips, Graham ; Tomarchio, Valerio

  • Author_Institution
    ENEA - EURATOM Assoc., UT-FUS, Frascati, Italy
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In the framework of the Broader Approach Agreement for the construction of the JT-60SA tokamak, ENEA is in charge to provide 9 of the 18 Toroidal Field (TF) coils. The 9 coils are being manufactured by ASG superconductors in Genoa under the supervision of ENEA in collaboration with the JT-60SA European home team. The winding line, which is the core of the project, has been assembled and will be used to wind the first set of Double Pancakes (DPs). The functional tests of the winding line and the tooling required for the DP manufacture is reported and the associated inspections to assess the compliance to the design tolerances are described. Successive steps in the Winding Pack (WP) coil manufacturing are the DP insulation, stacking of up to 6 DPs, insulation of the WP, electrical joints assembly and final impregnation using a D-shape impregnation mould. In this paper a description of the winding line installation and an overview of the principal equipment used during the manufacture of the first DP are presented.
  • Keywords
    Tokamak devices; plasma toroidal confinement; superconducting coils; ASG superconductors; Broader Approach Agreement framework; D-shape impregnation mould; JT-60SA European home team; JT-60SA magnet system; JT-60SA tokamak construction; double pancakes set; electrical joints assembly; first toroidal field coil; winding line installation; winding pack coil manufacturing; Coils; Conductors; Insulation; Joints; Stacking; Steel; Windings; JT-60SA tokamak; superconductors; winding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fusion Engineering (SOFE), 2013 IEEE 25th Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4799-0169-2
  • Type

    conf

  • DOI
    10.1109/SOFE.2013.6635462
  • Filename
    6635462