Title :
Electrical performance analysis of packaged CMOS ASIC devices and systems
Author :
Senthinathan, R. ; Prince, J.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
The performance of scaled and packaged CMOS devices is analyzed. A detailed investigation of methods of calculating simultaneous switching noise, including negative feedback influence, is performed. Equivalent chip-package interface circuits and closed-form equations are included. A method of modeling Leff as seen by the output driver circuit on its VDD/VSS path is investigated. Application specific output driver circuits are designed to minimize effective simultaneous switching noise. The performance and noise characteristics of such drivers are compared with those of conventional output drivers
Keywords :
CMOS integrated circuits; application specific integrated circuits; driver circuits; semiconductor device noise; closed-form equations; equivalent chip-package interface circuits; negative feedback; noise characteristics; output driver circuit; packaged CMOS devices; simultaneous switching noise; Application specific integrated circuits; Circuit noise; Delay; Driver circuits; Electronics packaging; Integrated circuit interconnections; Performance analysis; Semiconductor device modeling; Variable structure systems; Voltage;
Conference_Titel :
ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-0768-2
DOI :
10.1109/ASIC.1992.270272
