Electrical performance analysis of packaged CMOS ASIC devices and systems

Author

Senthinathan, R. ; Prince, J.L.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

fYear

1992

Firstpage

222

Lastpage

225

Abstract

The performance of scaled and packaged CMOS devices is analyzed. A detailed investigation of methods of calculating simultaneous switching noise, including negative feedback influence, is performed. Equivalent chip-package interface circuits and closed-form equations are included. A method of modeling L_eff as seen by the output driver circuit on its V_DD/V_SS path is investigated. Application specific output driver circuits are designed to minimize effective simultaneous switching noise. The performance and noise characteristics of such drivers are compared with those of conventional output drivers

Keywords

CMOS integrated circuits; application specific integrated circuits; driver circuits; semiconductor device noise; closed-form equations; equivalent chip-package interface circuits; negative feedback; noise characteristics; output driver circuit; packaged CMOS devices; simultaneous switching noise; Application specific integrated circuits; Circuit noise; Delay; Driver circuits; Electronics packaging; Integrated circuit interconnections; Performance analysis; Semiconductor device modeling; Variable structure systems; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International

Conference_Location

Rochester, NY

Print_ISBN

0-7803-0768-2

Type

conf

DOI

10.1109/ASIC.1992.270272

Filename

270272