Influence of PCBs coatings wettability on lead-free SMT solder joints reliability

Author

Sitek, J. ; Drozd, Z. ; Bukat, K.

Author_Institution

Tele & Radio Res. Inst., Warsaw, Poland

fYear

2008

Firstpage

55

Lastpage

60

Abstract

The paper presents results of wettability study of PCBs with immersion Sn, Ni/Au and SnCu coatings before reflow soldering process. Furthermore the solder joints were made in the optimal lead-free reflow soldering conditions using chosen materials with different wettability value of PCBs coatings and their reliability assessment was executed. The results of investigations have shown that exist direct influence PCBs coatings wettability on reliability of solder joints. It was find also that by using special procedure of PCBs coatings wettability assessment it is possible to predict future solder joints reliability.

Keywords

circuit reliability; coatings; printed circuit design; soldering; wetting; PCB coatings wettability; lead-free SMT solder joints reliability; soldering process; Assembly; Coatings; Electronic equipment testing; Environmentally friendly manufacturing techniques; Gold; Lead; Materials testing; Reflow soldering; Surface-mount technology; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276466

Filename

5276466