Title :
Technology and interconnect simulation for high-speed multi-chip modules
Author :
Gilbert, John R.
Author_Institution :
Motorola, Chandler, AZ, USA
Abstract :
High-performance systems utilizing ASICs must consider the ASIC interconnection impact on speed and signal quality. ASIC-to-ASIC interconnection is often the limiting factor. A systematic, modular approach to SPICE modeling and simulation is described. It incorporates off-chip drivers, pads, bonding, packaging and inter-ASIC interconnects. Emphasis is placed on device approximations in order to reduce circuit simulation time
Keywords :
SPICE; application specific integrated circuits; digital simulation; multichip modules; packaging; ASIC interconnection; ASIC-to-ASIC interconnection; SPICE modeling; bonding; circuit simulation time; device approximations; high-speed multi-chip modules; inter-ASIC interconnects; off-chip drivers; packaging; signal quality; Application specific integrated circuits; Bonding; Circuit simulation; Driver circuits; Integrated circuit interconnections; MOSFETs; Packaging; SPICE; Silicon; Transmission lines;
Conference_Titel :
ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-0768-2
DOI :
10.1109/ASIC.1992.270273
