DocumentCode
1608261
Title
Pulsed stress behavior of flexible thick film resistors
Author
Bonfert, D. ; Wolf, H. ; Gieser, H. ; Klink, G. ; Bock, K. ; Svasta, P. ; Ionescu, C.
Author_Institution
IZM-M, Fraunhofer Inst. Reliability & Microintegration, Munich, Germany
fYear
2008
Firstpage
45
Lastpage
50
Abstract
In order to investigate the behavior for very high current densities of polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of Transmission Line Pulsing (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the Device Under Test (DUT) during pulsing and helps to gain fundamental insights into the electrical behavior at higher current densities. The influence of the pulse amplitude on the current-voltage behavior was investigated on thick film carbon-based polymer resistors on flexible foil, like polyimide (Upilex). The resistance change due to an applied high voltage pulse stress is a measure of the ESD susceptibility of the thick film polymer resistors. The measurements show that the thick film flexible, carbon based resistors on Upilex foil are susceptible to high energy pulses. Parametric failure or catastrophic damage can occur.
Keywords
thick film resistors; carbon based resistor; current-voltage behavior; device under test; flexible substrate; flexible thick film resistor; pulse amplitude; pulsed measurement technique; pulsed stress behavior; thick film carbon-based polymer resistor; thick film polymer resistor; transmission line pulsing; Current density; Electrical resistance measurement; Polymer films; Pulse measurements; Resistors; Stress; Testing; Thick films; Thickness measurement; Voltage; ESD; Flexible Thick Film Resistors; Pulsed Stress; Transmission Line Pulsing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location
Budapest
Print_ISBN
978-1-4244-3972-0
Electronic_ISBN
978-1-4244-3974-4
Type
conf
DOI
10.1109/ISSE.2008.5276472
Filename
5276472
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