• DocumentCode
    1608261
  • Title

    Pulsed stress behavior of flexible thick film resistors

  • Author

    Bonfert, D. ; Wolf, H. ; Gieser, H. ; Klink, G. ; Bock, K. ; Svasta, P. ; Ionescu, C.

  • Author_Institution
    IZM-M, Fraunhofer Inst. Reliability & Microintegration, Munich, Germany
  • fYear
    2008
  • Firstpage
    45
  • Lastpage
    50
  • Abstract
    In order to investigate the behavior for very high current densities of polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of Transmission Line Pulsing (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the Device Under Test (DUT) during pulsing and helps to gain fundamental insights into the electrical behavior at higher current densities. The influence of the pulse amplitude on the current-voltage behavior was investigated on thick film carbon-based polymer resistors on flexible foil, like polyimide (Upilex). The resistance change due to an applied high voltage pulse stress is a measure of the ESD susceptibility of the thick film polymer resistors. The measurements show that the thick film flexible, carbon based resistors on Upilex foil are susceptible to high energy pulses. Parametric failure or catastrophic damage can occur.
  • Keywords
    thick film resistors; carbon based resistor; current-voltage behavior; device under test; flexible substrate; flexible thick film resistor; pulse amplitude; pulsed measurement technique; pulsed stress behavior; thick film carbon-based polymer resistor; thick film polymer resistor; transmission line pulsing; Current density; Electrical resistance measurement; Polymer films; Pulse measurements; Resistors; Stress; Testing; Thick films; Thickness measurement; Voltage; ESD; Flexible Thick Film Resistors; Pulsed Stress; Transmission Line Pulsing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276472
  • Filename
    5276472