Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors

Author

Bramlage, Silke ; Wolter, Klaus-Jurgen

Author_Institution

Electron. Packaging Lab., Dresden Univ. of Technol., Dresden, Germany

fYear

2008

Firstpage

32

Lastpage

36

Abstract

In light of the RoHS-directive, that came into effect on July 1st 2006, lead free solders gained immensely in importance. The growth of the interfacial intermetallic compound layer between lead free solders and thick film metalizations was studied. A SnAg3.0Cu0.5-, a SnAg3.0Cu0.5Ni0.06Ge0.01- and a reactive-solder (SnCu1 + SnAg3.5 + Pd2) were tested on Ag-, Ag/Pd- and Ag/Pt-conductors. Samples were aged thermally for up to 1000 h at 150 degC and up to 168 h at 175 degC. It is shown that the growth of the intemetallic compound layer is much more dependent on the choice of metalization than on the chosen solder. Furthermore a model of the temperature-dependence of the diffusional constant for the combinations studied is presented.

Keywords

RoHS compliance; ageing; copper alloys; germanium alloys; metallisation; nickel alloys; semiconductor growth; silver alloys; solders; thick film devices; tin alloys; RoHS-directive; SnAgCuNiGe; diffusional constant; interfacial intermetallic compound layer; intermetallic compound growth; lead free solder joint; thermal ageing; thick film conductor; thick film metalization; Bonding; Consumer electronics; Environmentally friendly manufacturing techniques; Intermetallic; Lead compounds; Scanning electron microscopy; Soldering; Temperature; Testing; Thick films; lead free solder; thick film;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276481

Filename

5276481