Crosstalk noise and signal propagation delay analysis in submicron CMOS integrated circuits

While transistors are at times used alone in supposed discrete form, their major applications are as part of integrated circuits (ICs), in which naturally millions of transistors are wired together. Based on the wiring schemes used, the resulting circuits have the capacity to store and retrieve information. The wiring layers in ICs are commonly referred to as interconnects and are integrated with transistors into the final device in a common arrangement of manufacture. Years ago, Micron technologies chip designers focus their works on devices analysis. The parasitic elements of interconnects such as coupling capacitance, leading to crosstalk and delay time problems were neglected. The introduction of deep submicron technologies corrected this carelessness. Interconnection wiring is gaining a considerable importance in speed of modern VLSI circuits. Now understanding interconnects is critical for chip design. The main reason for limiting VLSI circuits´ performances are interconnects propagation delay and crosstalk. With thinner metal width, coupling capacitance and intrinsic resistance of a wire can be taken into account. Indeed interconnects problems affect the reliability of microelectronic systems especially when the technology scales down and the frequency increases. In this paper crosstalk noise and delay time in deep submicron integrated circuit are considered.