Title :
Differences between solder bonds made with SnPbAg and SnAgCu solders
Author :
Tersztyanszky, Laszlo
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
Abstract :
Due to legislation and market trends, every electronic appliance assembler has to change leaded solders to lead free. In recent years, a number of manufacturers were simply waiting, and they know little or nothing about the behavior of lead free solders. However, there is now a necessity for lead free solders because the RoHS and WEEE directives are coming into effect by July 2006. To bring to light the particular differences between widely used industrial SnPbAg and SnAgCu solders, a test PCB for conventional SMT devices was designed and experimental soldering was done by IR reflow technology with both alloys.
Keywords :
assembling; copper alloys; environmental factors; lead alloys; legislation; printed circuit manufacture; printed circuit testing; reflow soldering; silver alloys; surface mount technology; tin alloys; IR reflow soldering technology; RoHS directive; SMT devices; SnAgCu; SnAgCu solders; SnPbAg; SnPbAg solders; WEEE directive; electronic appliance assembly; industrial solders; lead free solders; leaded solders; legislation; market trends; solder bonds; test PCB; Assembly; Consumer electronics; Electronic waste; Environmentally friendly manufacturing techniques; Home appliances; Lead; Legislation; Manufacturing industries; Surface-mount technology; Testing;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Print_ISBN :
0-7803-8422-9
DOI :
10.1109/ISSE.2004.1490858
