Title :
X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards
Author :
Hong, Jauwhei ; Chason, Marc
Author_Institution :
Motorola Inc., Ft. Lauderdale, FL, USA
Abstract :
X-ray diffraction has been used in conjunction with standard metallography to study the formation and growth of copper-tin intermetallic compounds and their effect on surface morphology on solder-coated printed-circuit boards. The diffraction technique lends itself very well to the detection of these compounds and to the monitoring of their evolution during thermal aging, especially in cases where coatings are so thin that various constituent phases cannot otherwise be discussed. Some growth characteristics revealed by this nondestructive method are presented.<>
Keywords :
X-ray diffraction examination of materials; ageing; copper alloys; nondestructive testing; printed circuits; reliability; soldering; tin alloys; CuSn intermetallic compounds; NDT; X-ray diffraction study; growth characteristics; intermetallic compounds growth monitoring; nondestructive method; reliability; solder-coated PC boards; standard metallography; surface morphology; thermal aging; Aging; Atmosphere; Coatings; Conducting materials; Copper; Intermetallic; Performance evaluation; Surface morphology; Temperature measurement; X-ray diffraction;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16167
