• DocumentCode
    1608911
  • Title

    Influence of production technology to reliability of interconnections in the LTCC modules

  • Author

    Urbancik, Jan ; Pietrikova, Alena

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
  • fYear
    2008
  • Firstpage
    13
  • Lastpage
    16
  • Abstract
    The goal of this paper is to present an influence of chosen production technology on quality and reliability of printed interconnections in multilayer Low Temperature Cofired Ceramics modules and to predict some of their properties. This was achieved by the mutual comparison of testing samples which were based on two different technologies. The comparison was performed after accelerated testing under severe conditions. By linking the conditions of the accelerated test with those that encountered during routine operation, it becomes possible to predict some reliability parameters and to consider the suitability of the proposed technology for batch production.
  • Keywords
    ceramic packaging; integrated circuit interconnections; integrated circuit reliability; life testing; LTCC modules; accelerated testing; interconnections reliability; multilayer Low Temperature Cofired Ceramics modules; printed interconnections; production technology; Batch production systems; Informatics; Integrated circuit interconnections; Life estimation; Materials testing; Nonhomogeneous media; Physics; Printing; Reliability; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276496
  • Filename
    5276496