DocumentCode
1608911
Title
Influence of production technology to reliability of interconnections in the LTCC modules
Author
Urbancik, Jan ; Pietrikova, Alena
Author_Institution
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
fYear
2008
Firstpage
13
Lastpage
16
Abstract
The goal of this paper is to present an influence of chosen production technology on quality and reliability of printed interconnections in multilayer Low Temperature Cofired Ceramics modules and to predict some of their properties. This was achieved by the mutual comparison of testing samples which were based on two different technologies. The comparison was performed after accelerated testing under severe conditions. By linking the conditions of the accelerated test with those that encountered during routine operation, it becomes possible to predict some reliability parameters and to consider the suitability of the proposed technology for batch production.
Keywords
ceramic packaging; integrated circuit interconnections; integrated circuit reliability; life testing; LTCC modules; accelerated testing; interconnections reliability; multilayer Low Temperature Cofired Ceramics modules; printed interconnections; production technology; Batch production systems; Informatics; Integrated circuit interconnections; Life estimation; Materials testing; Nonhomogeneous media; Physics; Printing; Reliability; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location
Budapest
Print_ISBN
978-1-4244-3972-0
Electronic_ISBN
978-1-4244-3974-4
Type
conf
DOI
10.1109/ISSE.2008.5276496
Filename
5276496
Link To Document