Abstract :
The following topics are dealt with: reliability physics; life-time prediction; non-destructive testing; nanotechnology; packaging; optoelectronics; system on chip; PCB; CAD; and biocompatible electronics.
Keywords :
life testing; nondestructive testing; optoelectronic devices; packaging; printed circuits; reliability; CAD; PCB; biocompatible electronics; life-time prediction; nanotechnology; non-destructive testing; optoelectronics; packaging; reliability physics; system on chip;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
DOI :
10.1109/ISSE.2008.5276497
