Thermal diffusivity and thermal conductivity measurement in thick — Film microsystems

The main aim of this work is to develop an experimental technique that would be suitable for determining the thermal properties (such as thermal diffusivity, thermal conductivity and specific heat) of resistive or conductive layers in microelectronic structures made in thick-film technology. The structural analysis of the typical thick-film components and the mathematical model with analytical solution were described in this paper. The solution of the analytical model (for the typical thick-film structure - active layer placed on alumina substrate) has been compared with the experimental results. The many factors which have influence on accuracy of obtained results have been taken into consideration and discussed.