Title :
Reliability analysis of small delay defects in vias located in signal paths
Author :
Villacorta, Hector ; Champac, Victor ; Hawkins, Chuck ; Segura, Jaume
Author_Institution :
Dept. of Electron. Eng., Nat. Inst. for Astrophys., Opt. & Electron.-INAOE, Puebla, Mexico
Abstract :
Vias-open defects are one of the dominant failures in modern nanometer technologies and may pose a reliability issue. In this paper, the reliability electromigration risk posed by undetected small delays due to resistive opens in vias located in signal paths is quantified. The Mean Time to Failure as function of the void size, using a cylinder model for the defective via, is estimated. Both effects, electromigration and self heating, have been considered. Reliability analysis considering redundant vias is also presented.
Keywords :
electromigration; integrated circuit reliability; dominant failures; modern nanometer technologies; reliability analysis; reliability electromigration risk; self heating; small delay defects; vias-open defects; Current density; Delay; Electromigration; Integrated circuit interconnections; Metals; Reliability; Resistance;
Conference_Titel :
Test Workshop (LATW), 2010 11th Latin American
Conference_Location :
Pule del Este
Print_ISBN :
978-1-4244-7786-9
Electronic_ISBN :
978-1-4244-7785-2
DOI :
10.1109/LATW.2010.5550366
