• DocumentCode
    1609429
  • Title

    Understanding stress enhanced performance in Intel 90nm CMOS technology

  • Author

    Giles, M.D. ; Armstrong, M. ; Auth, C. ; Cea, S.M. ; Ghani, T. ; Hoffmann, T. ; Kotlyar, R. ; Matagne, P. ; Mistry, K. ; Nagisetty, R. ; Obradovic, B. ; Shaheed, R. ; Shifren, L. ; Stettler, M. ; Tyagi, S. ; Wang, X. ; Weber, Charles ; Zawadzki, K.

  • Author_Institution
    Technol. CAD, Intel Corp., Hillsboro, OR, USA
  • fYear
    2004
  • Firstpage
    118
  • Lastpage
    119
  • Abstract
    A hierarchical, model-based understanding of the key physical effects underlying stress-induced device performance gain is presented, focusing on the large gains seen for uniaxial PMOS stress conditions and the vertical stress impact on NMOS gain.
  • Keywords
    CMOS integrated circuits; integrated circuit modelling; stress effects; 90 nm; Intel 90nm CMOS technology; NMOS gain; stress enhanced performance; stress-induced device performance gain; uniaxial PMOS stress conditions; vertical stress impact; Analytical models; CMOS technology; Germanium silicon alloys; MOS devices; Performance gain; Semiconductor device modeling; Silicon germanium; Tensile stress; Thermal stresses; Uniaxial strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2004. Digest of Technical Papers. 2004 Symposium on
  • Print_ISBN
    0-7803-8289-7
  • Type

    conf

  • DOI
    10.1109/VLSIT.2004.1345427
  • Filename
    1345427