DocumentCode
1609614
Title
Simulation on quantitative analysis of crack inspection by using eddy current stimulated thermography
Author
Feng Liu ; Suixian Yang ; Chunhu Leng ; Zhenwei Su
Author_Institution
Sch. of Manuf. Sci. & Eng., Sichuan Univ., Chengdu, China
fYear
2013
Firstpage
59
Lastpage
64
Abstract
Eddy current (EC) stimulated thermography has been proven to be an emerging integrative nondestructive approach for detecting and characterizing surface and subsurface cracks. In this paper, numerical simulation study has been conducted to understand EC stimulated thermography for defect inspection on metallic sample. It has been investigated that transient EC distribution and heating propagation for cracks with different lengths and depths. The simulations are carried out by using AC/DC module of COMSOL mul-tiphysics software. Image processing technique is proposed to analyze the thermal images obtained during the heating and cooling period of the inspection process. The proposed approach is proved to be capable of tracking the heat diffusion by processing the images sequentially. Understanding of transient EC distribution and heating propagation is the fundamental of quantitative nondestructive evaluation of crack inspection with EC stimulated thermography.
Keywords
crack detection; eddy currents; infrared imaging; nondestructive testing; AC/DC module; COMSOL multiphysics software; crack inspection; defect inspection; eddy current stimulated thermography; heating propagation; integrative nondestructive approach; metallic sample; quantitative analysis; Data models; Inspection; Materials; Resistance heating; Surface cracks; Temperature distribution; QNDE; eddy current; image processing; simulation; thermography;
fLanguage
English
Publisher
ieee
Conference_Titel
Nondestructive Evaluation/Testing: New Technology & Application (FENDT), 2013 Far East Forum on
Conference_Location
Jinan
Print_ISBN
978-1-4673-6018-0
Type
conf
DOI
10.1109/FENDT.2013.6635529
Filename
6635529
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