Title :
Simulation on quantitative analysis of crack inspection by using eddy current stimulated thermography
Author :
Feng Liu ; Suixian Yang ; Chunhu Leng ; Zhenwei Su
Author_Institution :
Sch. of Manuf. Sci. & Eng., Sichuan Univ., Chengdu, China
Abstract :
Eddy current (EC) stimulated thermography has been proven to be an emerging integrative nondestructive approach for detecting and characterizing surface and subsurface cracks. In this paper, numerical simulation study has been conducted to understand EC stimulated thermography for defect inspection on metallic sample. It has been investigated that transient EC distribution and heating propagation for cracks with different lengths and depths. The simulations are carried out by using AC/DC module of COMSOL mul-tiphysics software. Image processing technique is proposed to analyze the thermal images obtained during the heating and cooling period of the inspection process. The proposed approach is proved to be capable of tracking the heat diffusion by processing the images sequentially. Understanding of transient EC distribution and heating propagation is the fundamental of quantitative nondestructive evaluation of crack inspection with EC stimulated thermography.
Keywords :
crack detection; eddy currents; infrared imaging; nondestructive testing; AC/DC module; COMSOL multiphysics software; crack inspection; defect inspection; eddy current stimulated thermography; heating propagation; integrative nondestructive approach; metallic sample; quantitative analysis; Data models; Inspection; Materials; Resistance heating; Surface cracks; Temperature distribution; QNDE; eddy current; image processing; simulation; thermography;
Conference_Titel :
Nondestructive Evaluation/Testing: New Technology & Application (FENDT), 2013 Far East Forum on
Conference_Location :
Jinan
Print_ISBN :
978-1-4673-6018-0
DOI :
10.1109/FENDT.2013.6635529