DocumentCode
1609894
Title
Electrical connection network within an electrically conductive adhesive
Author
Busek, D. ; Mach, P.
Author_Institution
Fac. of Electr. Eng., Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
fYear
2008
Firstpage
184
Lastpage
188
Abstract
This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and differences between failures within soldered joints and electrically conductive adhesive joints. This article compares theoretical models with real measurement and properties of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.
Keywords
conductive adhesives; electrical conductivity; solders; electrical connection network; electrically conductive adhesive; micro-sized particles; nano-sized particles; soldered joints; Conductive adhesives; Conductivity measurement; Contact resistance; Electric resistance; Electric variables measurement; Lead; Nanoelectronics; Nanomaterials; Silver; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location
Budapest
Print_ISBN
978-1-4244-3972-0
Electronic_ISBN
978-1-4244-3974-4
Type
conf
DOI
10.1109/ISSE.2008.5276536
Filename
5276536
Link To Document