• DocumentCode
    1609894
  • Title

    Electrical connection network within an electrically conductive adhesive

  • Author

    Busek, D. ; Mach, P.

  • Author_Institution
    Fac. of Electr. Eng., Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
  • fYear
    2008
  • Firstpage
    184
  • Lastpage
    188
  • Abstract
    This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and differences between failures within soldered joints and electrically conductive adhesive joints. This article compares theoretical models with real measurement and properties of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.
  • Keywords
    conductive adhesives; electrical conductivity; solders; electrical connection network; electrically conductive adhesive; micro-sized particles; nano-sized particles; soldered joints; Conductive adhesives; Conductivity measurement; Contact resistance; Electric resistance; Electric variables measurement; Lead; Nanoelectronics; Nanomaterials; Silver; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276536
  • Filename
    5276536