DocumentCode :
1610027
Title :
Properties of copper film characterized by scanning acoustic microscope
Author :
Hongjuan Yan ; Kai Peng ; Chunguang Xu ; Qi Lin
Author_Institution :
Key Lab. of Fundamental Sci. for Adv. Machining, Beijing Inst. of Technol., Beijing, China
fYear :
2013
Firstpage :
141
Lastpage :
144
Abstract :
The scanning acoustic microscope is used to detect the properties of film or coating materials. The ultrasonic wave propagates in the materials with thickness h, sound velocity c, acoustic impedance Z2 between medium with acoustic impedance Z1. The echoes from different interfaces overlap and interfere. The interference phenomena are observed in spectrum of echoes. The spectrum has periodic maximums at integral multiples of base frequency f0. When thickness h is known, speed c of the specimen can be calculated by the relation of fn = nc/2h. According to the principle, the properties of copper films such as thickness, acoustic impendence and elastic modulus are detected by scanning acoustic microscopy. The experimental results are accorded with the actual properties of specimens.
Keywords :
acoustic impedance; acoustic microscopy; acoustic wave velocity; copper; elastic moduli; metallic thin films; ultrasonic propagation; Cu; acoustic impedance; coating materials; copper film; elastic modulus; interference phenomena; scanning acoustic microscopy; sound velocity; ultrasonic wave propagation; Acoustics; Copper; Films; Frequency measurement; Microscopy; Reflection; Thickness measurement; Acoustic impendence; Elastic modulus; Film; Scanning acoustic microscopy; Spectrum; Thickness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nondestructive Evaluation/Testing: New Technology & Application (FENDT), 2013 Far East Forum on
Conference_Location :
Jinan
Print_ISBN :
978-1-4673-6018-0
Type :
conf
DOI :
10.1109/FENDT.2013.6635544
Filename :
6635544
Link To Document :
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