Properties of copper film characterized by scanning acoustic microscope

Author

Hongjuan Yan ; Kai Peng ; Chunguang Xu ; Qi Lin

Author_Institution

Key Lab. of Fundamental Sci. for Adv. Machining, Beijing Inst. of Technol., Beijing, China

fYear

2013

Firstpage

141

Lastpage

144

Abstract

The scanning acoustic microscope is used to detect the properties of film or coating materials. The ultrasonic wave propagates in the materials with thickness h, sound velocity c, acoustic impedance Z₂ between medium with acoustic impedance Z₁. The echoes from different interfaces overlap and interfere. The interference phenomena are observed in spectrum of echoes. The spectrum has periodic maximums at integral multiples of base frequency f₀. When thickness h is known, speed c of the specimen can be calculated by the relation of f_n = nc/2h. According to the principle, the properties of copper films such as thickness, acoustic impendence and elastic modulus are detected by scanning acoustic microscopy. The experimental results are accorded with the actual properties of specimens.

Keywords

acoustic impedance; acoustic microscopy; acoustic wave velocity; copper; elastic moduli; metallic thin films; ultrasonic propagation; Cu; acoustic impedance; coating materials; copper film; elastic modulus; interference phenomena; scanning acoustic microscopy; sound velocity; ultrasonic wave propagation; Acoustics; Copper; Films; Frequency measurement; Microscopy; Reflection; Thickness measurement; Acoustic impendence; Elastic modulus; Film; Scanning acoustic microscopy; Spectrum; Thickness;

fLanguage

English

Publisher

ieee

Conference_Titel

Nondestructive Evaluation/Testing: New Technology & Application (FENDT), 2013 Far East Forum on

Conference_Location

Jinan

Print_ISBN

978-1-4673-6018-0

Type

conf

DOI

10.1109/FENDT.2013.6635544

Filename

6635544