• DocumentCode
    1610177
  • Title

    Nanomaterials and technology for conductive microstructures

  • Author

    Felba, Jan

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
  • fYear
    2008
  • Firstpage
    205
  • Lastpage
    210
  • Abstract
    Production of modern microelectronic devices needs printing technologies with the highest level of resolution and repeatability. Ink-jet technology makes it possible to dispense small volumes of a material in the range of tens picolitres. As the results the printed matrix of dots, lines and more complicated shapes have tens to hundreds micrometers scale. The printing of electrically conductive microstructures requires dispensed materials containing conductive particles as a filler. In the paper the systems for printing, possible results as well as background of nano silver production and its properties are presented. Just after ink-jet printing process the structures have the form of molecular fluid without any electrical conductivity hence special technologies for obtaining the printed microstructures with very high conductance have to be applied. As the result it is possible to make lines and complicated shapes with resitivity in range 10-6 Ohm cm.
  • Keywords
    conducting materials; ink jet printing; integrated circuit manufacture; nanoelectronics; nanostructured materials; conductive particles; dispensed materials; electrically conductive printed microstructures; filler; ink-jet technology; modern microelectronic device production; molecular fluid; nano silver production; nanomaterials; printed matrix; printing technologies; Conducting materials; Flexible printed circuits; Ink; Microstructure; Nanomaterials; Printing; Production; Shape; Space technology; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276548
  • Filename
    5276548