Title :
Development of sol-gel integrated optical waveguide for Electro-Optical PCB
Author :
Siesicki, Michal ; Nieweglowski, Krzysztof ; Wolter, Klaus-Jurgen ; Patela, Sergiusz
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
For several years data rate limitation in printed circuit technology becomes more and more actually. A promising approach to increase bandwidth in the future links are integrated optical interconnections. The next generation PCBs will be Electro-Optical Printed Circuit Board (EOPCB). Polymer optical waveguides on the basis of cost effective sol-gel materials are one possible solution to be up to data rate requirements. "Waveguide-in-copper" enables realization of optical interconnects on the PCB-level. The additive technology by using copper electroplating offers improvement in structuring of fine pitch. In this paper design, development and fabrication of integrated waveguides will be described in detail. The structuring of host material with use of typical PCB-techniques as well as different sol-gel materials and methods of coating polymer layers are presented.
Keywords :
electro-optical devices; electroplating; fine-pitch technology; integrated optoelectronics; optical interconnections; optical polymers; optical waveguides; polymer films; printed circuits; sol-gel processing; additive technology; copper electroplating; electro-optical PCB; fine pitch structuring; integrated optical interconnections; integrated waveguide fabrication; polymer layer coating; polymer optical waveguides; printed circuit technology; sol-gel integrated optical waveguide; Bandwidth; Costs; Electrooptical waveguides; Integrated circuit technology; Integrated optics; Optical interconnections; Optical materials; Optical polymers; Optical waveguides; Printed circuits;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276557