• DocumentCode
    1610385
  • Title

    Development of sol-gel integrated optical waveguide for Electro-Optical PCB

  • Author

    Siesicki, Michal ; Nieweglowski, Krzysztof ; Wolter, Klaus-Jurgen ; Patela, Sergiusz

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
  • fYear
    2008
  • Firstpage
    222
  • Lastpage
    227
  • Abstract
    For several years data rate limitation in printed circuit technology becomes more and more actually. A promising approach to increase bandwidth in the future links are integrated optical interconnections. The next generation PCBs will be Electro-Optical Printed Circuit Board (EOPCB). Polymer optical waveguides on the basis of cost effective sol-gel materials are one possible solution to be up to data rate requirements. "Waveguide-in-copper" enables realization of optical interconnects on the PCB-level. The additive technology by using copper electroplating offers improvement in structuring of fine pitch. In this paper design, development and fabrication of integrated waveguides will be described in detail. The structuring of host material with use of typical PCB-techniques as well as different sol-gel materials and methods of coating polymer layers are presented.
  • Keywords
    electro-optical devices; electroplating; fine-pitch technology; integrated optoelectronics; optical interconnections; optical polymers; optical waveguides; polymer films; printed circuits; sol-gel processing; additive technology; copper electroplating; electro-optical PCB; fine pitch structuring; integrated optical interconnections; integrated waveguide fabrication; polymer layer coating; polymer optical waveguides; printed circuit technology; sol-gel integrated optical waveguide; Bandwidth; Costs; Electrooptical waveguides; Integrated circuit technology; Integrated optics; Optical interconnections; Optical materials; Optical polymers; Optical waveguides; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276557
  • Filename
    5276557