DocumentCode :
161090
Title :
Electrical quality of 28nm HK/MG MOSFETs with PDA and DPN treatment
Author :
Win-Der Lee ; Chun-Wei Lian ; Shea-Jue Wang ; Yi-Hong Yu ; Cheng, Osbert ; Huang, L.S. ; Mu-Chun Wang
Author_Institution :
Dept. of Electr. Eng., Lee-Ming Inst. of Technol., Taipei, Taiwan
fYear :
2014
fDate :
7-10 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
On the basis of tested data, the performance of NMOSFETs with PDA treatment in drive current, S.S. values and channel mobility is superior to that with DPN treatment. Comparing two nitridation treatment processes at the same annealing temperature, it seems that PDA proving the hydrogen to fix the dangling bond on the channel surface is more beneficial for device performance before the reliability test. Furthermore, the capability in healing of oxygen vacancy of gate dielectric is little better than that with DPN, illustrating in lower gate leakage, especially as the channel length is narrowed down.
Keywords :
MOSFET; annealing; dangling bonds; high-k dielectric thin films; nitridation; plasma materials processing; semiconductor device reliability; vacancies (crystal); DPN treatment; HK/MG MOSFETs; NMOSFETs; PDA treatment; annealing temperature; channel mobility; channel surface; dangling bond; drive current; electrical quality; gate dielectric; gate leakage; high-k metal gate technology; low-pressure decoupled plasma nitridation process; oxygen vacancy; post deposition annealing; reliability test; size 28 nm; Annealing; Dielectrics; Gate leakage; Logic gates; MOSFET; Metals; decoupled plasma nitridation; gate dielectric; gate leakage; high-k; metal gate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Next-Generation Electronics (ISNE), 2014 International Symposium on
Conference_Location :
Kwei-Shan
Type :
conf
DOI :
10.1109/ISNE.2014.6839328
Filename :
6839328
Link To Document :
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