Title :
Monitoring of the temperature profile of vapour phase reflow soldering
Author :
Livovsky, Lubomir ; Pietrikova, Alena ; Durisin, Juraj
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
Abstract :
With the introduction of lead free electronics assembly worldwide, greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead-free production, greater care must be introduced to ensure proper reflow process control along with data logging for product traceability. Reflow profiles must be more precise in a lead free process since the reflow temperatures of the lead free materials can approach the temperature tolerance of some of the components.
Keywords :
assembling; reflow soldering; data logging; lead free electronics assembly; lead-free production; leaded production; product traceability; reflow process control; temperature profile monitoring; vapour phase reflow soldering; Environmental factors; Environmentally friendly manufacturing techniques; Lead; Packaging; Production; Reflow soldering; Temperature dependence; Temperature measurement; Temperature sensors; Toxicology;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276585
