DocumentCode
1611440
Title
Distributed product engineering for microsystems devices
Author
Hahn, Kai ; Schmidt, Thilo ; Mielke, Matthias ; Brück, Rainer ; Ortloff, Dirk ; Popp, Jens
Author_Institution
Univ. of Siegen, Siegen, Germany
fYear
2010
Firstpage
453
Lastpage
457
Abstract
Product engineering for microsystems or MEMS (micro-electromechanical system) devices comprises the design of the structure as well as the definition of its manufacturing process flow. The approach is characterized by application specific fabrication flows, i.e. fabrication processes (built up by a large variety of process steps and materials) depending on the later product. Customer-tailored functions and specifications require a deep involvement of the customer throughout the complete value chain. Often the varying stages of the product engineering flow are carried out by diverse companies (or at least different departments) in different locations. In this paper we introduce a comprehensive methodology and based on that a concept for a distributed environment for customer-oriented product engineering of MEMS products. The development is currently carried out in an international EU research project.
Keywords
micromechanical devices; production engineering; MEMS devices; application specific fabrication flows; customer-oriented product engineering; customer-tailored functions; distributed product engineering; international EU research project; microelectromechanical system; microsystems devices; Collaboration; Companies; Fabrication; Micromechanical devices; Programming; Software; MNT design; distributed multi-site engineering; information management; process design; product engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
Conference_Location
Warsaw
Print_ISBN
978-1-4244-7011-2
Electronic_ISBN
978-83-928756-4-2
Type
conf
Filename
5551296
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