Title :
Electro-magnetic interference reducing solutions for package stacking applications
Author :
Lu, Jiun-you ; Chen, Wei-Chi ; Wu, Sung-Mao ; Wang, Kao-Yi ; Lin, Ming-Shan ; Chang, Yen-Tang
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
Abstract :
This paper discuss about System in Package (SIP) about Package on Package (POP). When the signals transmit, the staked substrate between upper and nether will cause the Electromagnetic Interference (EMI) which makes the performance of the circuit become worse. The purpose of this research is to establish a multi-board structure and use it to simulate the EMI of the POP packages. To discuss whether the EMI can be decrease efficiently by use of VIA structure.
Keywords :
electromagnetic interference; system-in-package; EMI; POP packages; VTA structure; electro-magnetic interference reducing solutions; electromagnetic interference; multiboard structure; package on package; package stacking applications; signals transmission; staked substrate; system in package; Coils; Electromagnetic interference; Periodic structures; Power transmission lines; Resonant frequency; Substrates; Electromagnetic interference (EMI); package on package (POP); package substrate; system in package (SIP);
Conference_Titel :
Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4577-2034-5
