Radiation modeling and performance reconstructing of signal connection in package substrate using non-contacting probe

Signal connection in different package substrate layers by PTH via affect the quality of signals seriously and difficult to measure by traditional methods. In this paper, a new radiation model is proposed to evaluate signal quality by novel non-contacting measurement method. In order to perform this novel non-contacting measurement method, the signal performance between non-contacting loop-type probe and single-end transmission line is reconstructed by radiation model, and compared with VNA measurement and 3D-EM simulation. Radiation model, reconstructing method and performance comparison results are shown in this research.