Title :
Availability-Constrained Multipath Protection in Backbone Networks with Double-Link Failure
Author :
Ma, Han ; Fayek, Dalia ; Ho, Pin-Han
Author_Institution :
Sch. of Eng., Univ. of Guelph, Guelph, ON
Abstract :
Reliability is crucial for high speed backbone networks. Protection mechanisms are therefore critical in the design of infrastructure networks. This paper investigates a new multi- path provisioning model with availability-guarantee on networks where events of up to two simultaneous link failures can occur. A service level agreement (SLA) which mandates service availability must be met even during network failure situations. We present a mathematical formulation to perform optimal capacity allocation in both GMPLS Self-protecting Multi-path (SPM) environment and SONET/SDH networks. Linear Programming (LP) and Integer Linear Programming (ILP) models are formulated in this study to provide multi-path protection mechanisms on MPLS and SONET/SDH networks. Network Service Providers (NSP) could use this mathematical model to design a network with certain availability requirement according to a priori defined SLAs to accommodate network traffic under dual link failure scenarios.
Keywords :
SONET; integer programming; linear programming; multiprotocol label switching; synchronous digital hierarchy; telecommunication network reliability; telecommunication traffic; GMPLS self-protecting multipath environment; SONET/SDH network; availability-constrained multipath protection; double-link network failure; generalized multiprotocol label switching; high speed backbone network; integer linear programming; network service provider; network traffic; optimal capacity allocation; service level agreement; Availability; Integer linear programming; Linear programming; Mathematical model; Multiprotocol label switching; Protection; SONET; Scanning probe microscopy; Spine; Synchronous digital hierarchy;
Conference_Titel :
Communications, 2008. ICC '08. IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2075-9
Electronic_ISBN :
978-1-4244-2075-9
DOI :
10.1109/ICC.2008.37