DocumentCode :
1611712
Title :
Opportunities and challenges for high-k gate dielectrics
Author :
Ma, T.P.
Author_Institution :
Center for Microelectron. Mater. & Structures, New Haven, CT, USA
fYear :
2004
Firstpage :
1
Lastpage :
4
Abstract :
Some key issues related to the development of high-k dielectric technology, including gate stack processing, formation of interfacial layers, EOT (equivalent oxide thickness) control, thermal stability, leakage current, trapping, and mobility degradation are reviewed and discussed. The problems with the conventional mobility extraction methodology for high-k gated MOSFETs is pointed out, and an improved methodology is demonstrated. A novel electrical characterization technique, named the IETS (inelastic electron tunneling spectroscopy), is shown to be capable of revealing a wealth of information of a MOS structure, including phonon modes of both the electrodes and the gate dielectric, impurity bonding structures, and electronic traps.
Keywords :
MOSFET; carrier mobility; dielectric materials; dielectric measurement; dielectric thin films; electron traps; hole traps; leakage currents; phonons; thermal stability; tunnelling spectroscopy; EOT control; IETS; charge trapping; dielectric technology; electrical characterization technique; electrode phonon modes; electronic traps; equivalent oxide thickness; gate dielectric phonon modes; gate stack processing; high-k gate dielectrics; high-k gated MOSFET; impurity bonding structures; inelastic electron tunneling spectroscopy; interfacial layer formation; leakage current; mobility degradation; mobility extraction methods; thermal stability; trapping; Data mining; Electron traps; High K dielectric materials; High-K gate dielectrics; Leakage current; MOSFETs; Thermal degradation; Thermal stability; Thickness control; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Print_ISBN :
0-7803-8454-7
Type :
conf
DOI :
10.1109/IPFA.2004.1345516
Filename :
1345516
Link To Document :
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