Displacement measurement method for advanced electronic packaging

Process of increasing structure integration density in microelectronics contributes to even more restricted tolerances of electronic packaging. For this reason advanced packages must be measured with very high accuracy. In this paper we describe the current status of our research on the white light interferometer with a reference light beam. We use it as the measuring beam while the laser beam acts as a referee. The acquaintance of the reference mirror position in our interferometer is a condition for the accurate measurement. Due to this fact, we provide a measurement technique that allows us using motors with non constant velocity