Cost-effective and high-performance FBAR duplexer module with wafer level packaging

Author

Bae, Hyun-Cheol ; Kim, Sung-Chan ; Moon, Jong-Tae ; Choi, Kwang-Seong

Author_Institution

Package Res. Team, Electron. & Telecommun. Res. Inst., Daejeon, South Korea

fYear

2011

Firstpage

1074

Lastpage

1077

Abstract

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for USPCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The highest insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

Keywords

acoustic resonators; bulk acoustic wave devices; mobile handsets; printed circuits; transfer moulding; wafer bonding; wafer level packaging; PCB board; Rx band; Tx band; USPCS handset applications; cost-effective FBAR duplexer module; film bulk acoustic resonator duplexer module; glass wafer level packaging process; glass-wafer bonded Tx-Rx FBAR devices; high-performance FBAR duplexer module; insertion losses; silicon capping process; transfer molding material; Band pass filters; Film bulk acoustic resonators; Glass; Insertion loss; Packaging; Phase shifters; Resonator filters; duplexer; film bulk acoustic resonator; glass cap wafer; wafer level packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2011 Asia-Pacific

Conference_Location

Melbourne, VIC

Print_ISBN

978-1-4577-2034-5

Type

conf

Filename

6173941