Title :
A measurement method for placement capability of ultrasonic wedge-wedge wire bonding process
Author :
Krille, S. ; Fritzsche, H. ; Bauer, R. ; Keil, M. ; Wohlrabe, H.
Keywords :
Aluminum; Bonding processes; Electric variables measurement; Electronics packaging; Laboratories; Manufacturing; Microelectronics; Optical interconnections; Ultrasonic variables measurement; Wire;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1490989
