Title :
Characterization of thermally conductive epoxy nano composites
Author :
Ekstrand, Lisa ; Kristiansen, Helge ; Liu, Johan
Author_Institution :
SMIT Centre, Shanghai Univ.
Abstract :
This work aims to develop an anisotropic conductive adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment. The thermal measurements are carried out by transient hot wire method. So far, the thermal conductivity of the epoxy has been increased with more than 100%
Keywords :
adhesives; alumina; carbon nanotubes; composite insulating materials; conducting polymers; materials preparation; nanocomposites; nanoparticles; silicon compounds; thermal conductivity; alumina oxide; anisotropic conductive adhesive paste; carbon nanotubes; conductive filler particles; epoxy nanocomposites; insulating materials; microscale particles; nanoscale particles; polymer based resin; silicon carbide; thermal conductivity; Anisotropic magnetoresistance; Carbon nanotubes; Conductive adhesives; Dielectrics and electrical insulation; Polymers; Resins; Silicon carbide; Surface treatment; Thermal conductivity; Wire;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1490994
