Double-sided preheating influence on solderability

Author

Harant, Petr ; Steiner, Frantisek

Author_Institution

Univ. of West Bohemia, Pilsen, Czech Republic

fYear

2008

Firstpage

379

Lastpage

384

Abstract

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electroless nickel immersion gold), OSP (organic solderability preservative) and pure copper.

Keywords

IEC standards; printed circuit testing; soldering; solders; wetting; (organic solderability preservative); IEC 60068-2-54; IPC/EIA J-STD- F012 003A; PCB; double-sided preheating influence; electroless nickel immersion gold; galvanic tin; immersion tin; lead-free surface finish types; molten solder; printed circuit boards; pure copper; solderability evaluation methods; solderability testing; surface finishing; wetting balance test; Circuit testing; Environmentally friendly manufacturing techniques; Force measurement; Galvanizing; IEC standards; Lead; Printed circuits; Surface finishing; Time measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276633

Filename

5276633