• DocumentCode
    1612420
  • Title

    An electronic ballast with inductively coupled preheating circuits

  • Author

    Wu, T.-F. ; Chen, C.-C. ; Wu, J.-N.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan
  • Volume
    1
  • fYear
    2001
  • Firstpage
    517
  • Abstract
    This paper presents an electronic ballast with inductively coupled preheating circuits based on a half-bridge series-resonant parallel loaded inverter. A ballast with the circuits can ignite lamps at low temperature (-30/spl deg/C), while still keeping filaments properly preheated. This can save energy for nondimmable ballasts by reducing the filament voltage and can increase lamp life by reducing voltage stress imposed on lamps during start-up transition. Moreover the proposed preheating circuits can be readily modified to fit to other types of lamps by adjusting the turns ratio of the coupled inductors and/or the capacitance of their series capacitors. Hardware measurements have verified that 20000 on-off tests (25-second on and 35-second off) for PLT 42 W lamps have been conducted without observing significant sputtering.
  • Keywords
    bridge circuits; capacitance; capacitors; electric heating; electromagnetic induction; fluorescent lamps; invertors; lamp accessories; resonant power convertors; -30 C; 25 s; 35 s; 42 W; capacitance; coupled inductors; electronic ballast; filament voltage reduction; filaments preheating; fluorescent lamps; half-bridge series-resonant parallel loaded inverter; hardware measurements; inductively coupled preheating circuits; lamp ignition; low temperature; nondimmable ballasts; series capacitors; turns ratio; voltage stress reduction; Capacitance; Capacitors; Coupling circuits; Electronic ballasts; Inductors; Inverters; Lamps; Stress; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE
  • Conference_Location
    Chicago, IL, USA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-7114-3
  • Type

    conf

  • DOI
    10.1109/IAS.2001.955469
  • Filename
    955469