Influence of flux activity on process parameters and solder joints in lead-free wave soldering

Author

Sitek, Janusz ; Bukat, Krystyna

Author_Institution

Res. Group for Adv. Lead-free Assembly Technol., Tele & Radio Res. Inst., Warsaw

fYear

0

Firstpage

100

Lastpage

105

Abstract

Electronics manufacturing has responded well to environmental concerns such as role of CFCs (and related compounds) in stratospheric ozone depletion (Cala and Winston, 1996), and the toxicity of lead. To those who understand these demands the producers of fluxes recommend VOC-free fluxes especially for lead free wave soldering. This paper reports investigation of the influence of the VOC-free flux properties on lead-free wave soldering process. Three commercial no-clean liquid fluxes which based on water were used for PCBs soldering with SnAg and SnAgCu alloys on the wave machines. The influence of fluxes properties and nitrogen atmosphere on wave process parameters and solder joints quality were established. The conclusions important for lead-free wave soldering practice are presented

Keywords

copper alloys; printed circuit manufacture; silver alloys; solders; tin alloys; wave soldering; PCB soldering; SnAgCu; VOC-free fluxes; flux activity; lead-free wave soldering; no-clean liquid fluxes; solder joint quality; solder joints; water-based fluxes; wave process parameters; Assembly; Atmosphere; Cleaning; Environmentally friendly manufacturing techniques; Force measurement; Lead; Soldering; Solvents; Testing; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

Conference_Location

Wiener Neustadt

Print_ISBN

0-7803-9325-2

Type

conf

DOI

10.1109/ISSE.2005.1491008

Filename

1491008