Title :
Finite element modeling of surface mount devices
Author :
Novotny, Marek ; Bulva, Jindrich ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol.
Abstract :
The aim of this paper is to improve reliability of SMD connecting and to increase durability of these structures. 3D finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool
Keywords :
finite element analysis; interconnections; printed circuits; reliability; shear deformation; solders; surface mount technology; viscoplasticity; -40 to 125 C; 3D finite element modeling; accelerated temperature cycling conditions; creep strain energy based models; maximal stress value; surface mount device modeling; time-dependent solder joint fatigue response; Acceleration; Capacitive sensors; Creep; Fatigue; Finite element methods; Joining processes; Shearing; Soldering; Stress; Temperature;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491010
