Finite element modeling of surface mount devices

Author

Novotny, Marek ; Bulva, Jindrich ; Szendiuch, Ivan

Author_Institution

Dept. of Microelectron., Brno Univ. of Technol.

fYear

0

Firstpage

113

Lastpage

117

Abstract

The aim of this paper is to improve reliability of SMD connecting and to increase durability of these structures. 3D finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool

Keywords

finite element analysis; interconnections; printed circuits; reliability; shear deformation; solders; surface mount technology; viscoplasticity; -40 to 125 C; 3D finite element modeling; accelerated temperature cycling conditions; creep strain energy based models; maximal stress value; surface mount device modeling; time-dependent solder joint fatigue response; Acceleration; Capacitive sensors; Creep; Fatigue; Finite element methods; Joining processes; Shearing; Soldering; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

Conference_Location

Wiener Neustadt

Print_ISBN

0-7803-9325-2

Type

conf

DOI

10.1109/ISSE.2005.1491010

Filename

1491010