Heat transfer modeling for soldering processes of SMD´s to printed circuit boards using low inert infrared heaters

The investigation deals with soldering processes modeling in machines for surface mounting technologies (SMT) with new type of low inert heaters for the middle infrared spectral region. Its purpose is to be used for electronic control in soldering techniques for surface mounted devices (SMD). The approach to thermodynamic processes description is considered. The main parameters of heat transfer processes are analyzed. The proposed model describes heat transfer processes in soldering camera as a function of time and camera dimensions. The influence of the main parameters of heaters´ operation and hot gas circulation in the camera on the temperature distribution upon the PCB (printed circuit boards) is investigated