DocumentCode
1612805
Title
SMT GOES GREEN: investigations on an optimization of lead-free solder pastes using wetting tests, solder balling tests, and screen printing tests with simulated process breaks
Author
Detert, Markus ; Herzog, Thomas ; Wolter, Klaus-Jürgen ; Zerna, Thomas
fYear
2005
Firstpage
167
Lastpage
172
Keywords
Circuit testing; Electronic equipment testing; Environmental factors; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Printed circuits; Printing; Surface-mount technology; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN
0-7803-9325-2
Type
conf
DOI
10.1109/ISSE.2005.1491021
Filename
1491021
Link To Document