1612805

SMT GOES GREEN: investigations on an optimization of lead-free solder pastes using wetting tests, solder balling tests, and screen printing tests with simulated process breaks

Detert, Markus ; Herzog, Thomas ; Wolter, Klaus-Jürgen ; Zerna, Thomas

2005

167

172

Circuit testing; Electronic equipment testing; Environmental factors; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Printed circuits; Printing; Surface-mount technology; Virtual manufacturing;

English

ieee

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

0-7803-9325-2

conf

10.1109/ISSE.2005.1491021

1491021