DocumentCode
1612899
Title
The effect of lead free soldering on formation of black pad failure
Author
Krammer, Oliver
fYear
2005
Firstpage
191
Lastpage
195
Keywords
Assembly; Atherosclerosis; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Ocean temperature; Sea surface; Soldering; Surface finishing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN
0-7803-9325-2
Type
conf
DOI
10.1109/ISSE.2005.1491025
Filename
1491025
Link To Document