Title :
The effect of lead free soldering on formation of black pad failure
Keywords :
Assembly; Atherosclerosis; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Ocean temperature; Sea surface; Soldering; Surface finishing;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491025
