Title :
Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Author :
Roellig, Mike ; Dudek, Rainer ; Wiese, Steffen ; Wunderle, Berhard ; Wolter, Klaus-Jürgen ; Michel, Bernd
Author_Institution :
Dresden Univ. of Technol.
Abstract :
The paper presents the method of generating lifetime-prediction-laws on special prepared specimen. The combination of thin- and thick-film technology allows building up test probes very similar to electronic packages including the measurement issues. Influences of pad surface metallurgy, microstructure of solder and in eutectic solder alloys are regarded. The investigation objects provide monitoring of electrical and mechanical damage process of SnAgCu-solder bump. Different thermo-mechanical loads are applied in ranges of 0degC to +80degC, -20degC to +90degC, -40degC to +125degC and -50degC to + 150degC. The results of these tests and give universal lifetime-prediction laws for SnAgCu base solder joints. Main goals are to find coefficients for lifetime prediction models of lead-free SAC-solder. One issue points on the Coffin-Mason relation, which can be used in common FEM-tool. The other problem employs the empirical model of Norris-Landzberg relation
Keywords :
copper alloys; eutectic alloys; materials testing; silver alloys; solders; tin alloys; -20 to 90 C; -40 to 125 C; -50 to 150 C; 0 to 80 C; Coffin-Mason relation; FEM tool; Norris-Landzberg relation; SnAgCu; electrical damage process; electronic packages; eutectic solder alloys; lead-free solder contacts; lifetime prediction models; mechanical damage process; pad surface metallurgy; solder joints; solder microstructure; special prepared specimen; test probes; thick-film technology; thin-film technology; universal lifetime-prediction laws; Electronic equipment testing; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Life testing; Microstructure; Monitoring; Probes; Thermomechanical processes; Thickness measurement;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491037
