Pore formation in lead-free solders on Cu- and Ag-metallization

Author

Gschohsmann, W. ; Smetana, W. ; Fleischer, W.

Author_Institution

Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol.

fYear

0

Firstpage

265

Lastpage

271

Abstract

Solder paste is commonly applied in electronics assemblies in order to form electrical and mechanical joints between circuit metallization pads and surface mount components. Thus, the solder joint integrity is a critical aspect to be considered because it impacts strength and reliability of the bond. A major type of defects encountered in solder joints are pores. Porosity in solder joints may affect bond strength, weaken electrical and thermal conductivity. Two factors responsible for pore formation are the portion of organic hinder and flux in solder paste and the temperature profile of the soldering process

Keywords

impact strength; metallisation; porosity; reliability; soldering; solders; Ag; Cu; bond reliability; circuit metallization pads; electrical conductivity; electrical joints; electronics assemblies; impacts strength; mechanical joints; porosity; solder joint integrity; solder paste; soldering process; surface mount components; temperature profile; thermal conductivity; Bonding; Circuits; Data engineering; Environmentally friendly manufacturing techniques; Inorganic materials; Lead; Metallization; Soldering; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

Conference_Location

Wiener Neustadt

Print_ISBN

0-7803-9325-2

Type

conf

DOI

10.1109/ISSE.2005.1491038

Filename

1491038